TAICHUNG, Taiwan – October 24, 2017 — Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustMETM Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification. As the industry’s first Common Criteria EAL5+ certified Secure Flash, and now with … Continue reading "Winbond Introduces TrustMETM Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture"
The post Winbond Introduces TrustMETM Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture appeared first on Trusted Computing Group.
The post Winbond Introduces TrustMETM Secure Flash Memory Implementing the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture appeared first on Security Boulevard.
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